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The ever-growing importance of semiconductor devices over recent years has been driving demand for improved manufacturing prformance, especially for leading-edge devices. Moreover, semiconductor manufacturing facilities are becoming ever more automated, pushing ahead with DX and adopting smart manufacturing concepts.
Meanwhile, the semiconductor manufacturing industry is confronting the challenges that come with the adoption of smart practices across a range of areas, including processes, production equipment, and process integration. In response, Hitachi has been developing solutions that support digital twins for these different areas.
This article focuses on the optimization of process conditions development, making maintenance more efficient, and shortening development timelines for process integration, describing the research and development of smart techniques for resolving the challenges that these goals pose.
